We have a full set of mold flow analysis data testing and analysis capabilities, so that we can obtain stress-strain curve, tensile modulus, Poisson's ratio, PVT, CLTE, specific heat, thermal conductivity, viscosity and other material characteristics parameters. Related analysis files can be imported into the mold flow analysis software to accuratelly simulate plastic injection molding process, provide optimization suggestions and improveprograms, which improving product quality and production efficiency.
Material characteristic parameters required by flow analysis
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材料描述 |
系列、牌号、制造商、名称缩写、材料类型等 |
推荐工艺 |
模具表面温度及范围、熔体温度及范围、绝对最大熔体温度、顶出温度、最大剪切应力和速率等 |
属性 |
测试项目 |
测试设备 |
流变特性 |
剪切粘度(曲线) |
高压毛细管流变仪 |
玻璃化转变温度 |
DSC |
熔体质量流动速率 |
熔体流动速率仪 |
热性能 |
比热容 |
DSC |
导热系数 |
PVT |
PVT特性 |
熔体密度 |
熔体流动速率仪 |
固体密度 |
固体密度计 |
PVT曲线 |
PVT |
机械性能 |
弹性模量 |
万能材料试验机 |
泊松比 |
万能材料试验机 |
剪切模量 |
万能材料试验机 |
线性膨胀系数CLTE |
TMA |
拉伸应力应变曲线 |
万能材料试验机 |
收缩性能 |
收缩率
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修正残余应力、残余应变模型 |
填料特性 |
描述及含量 |
Viscosity: The viscosity data refers to the material viscosity at different temperatures and shear rates, which affects the filling analysis results of the material and has an impact on the prediction of filling pressure and locking force
PVT: Specific volume data refers to the change in specific volume of a material under different pressures and temperatures, which affects the results of pressure holding analysis and has an impact on the prediction of shrinkage marks and shrinkage rates
Heat Capacity: Specific heat is related to cooling analysis and affects wavefront temperature changes, forming cycles, etc
Mechanical Properties: Mechanical properties include elastic modulus, Poisson's ratio, CLTE, etc., which affect the accuracy of warping analysis
Crystallinity: The inherent characteristic of crystalline materials, and the cooling rate can affect crystallinity. It is used to correct PVT and affect the accuracy of warping
Viscoelasticity: Parameters required for flow viscoelasticity and solid viscoelasticity, tiger skin patterns, snake like patterns, optical analysis, and stress release analysis in thermal processes
Thermal conductivity: The thermal conductivity is related to cooling analysis and affects wavefront temperature changes, forming cycles, etc