Non destructive testing refers to the method of inspecting and testing the structure, properties, status, type, quantity, shape, position, and size of defects inside and on the surface of a specimen using changes in thermal, acoustic, optical, electrical, magnetic, and other reactions caused by structural abnormalities or defects within the material, without damaging the performance of the object being tested and the internal organization of the object being tested. By measuring these changes, we can understand and evaluate the properties, status, quality, or internal structure of the materials and equipment components being tested.
Application project:
(1) X-RAY is used for observing PCB circuit disconnection, IC defects, solder joint disconnection, solder joint bonding, component structure, etc;
(2) CSAM: Analysis of the internal structure of component packaging, internal cracks, voids, bubbles, etc;
(3) CT: Structural analysis, defect analysis, dimension measurement, reverse analysis, CAD digital and analog comparison.
Non destructive testing solutions in the field of electronic communication:
We can provide comprehensive solutions such as acoustic (CSAM), optical (X-ray, CT), electrical (electrical measurement equipment), thermal (thermal infrared imaging device), magnetic (short circuit tracking device, etc.).